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In SMT chip processing, what are the main points of designing PCB pads?

时间:2022-08-29   访问量:1860

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SMT chip processing is our common printed circuit board processing, and it is used in many places around us. In order to ensure the quality of the SMT patch, when we process the SMT patch, we need to place the PCB pad, so as to ensure that there is no problem in the SMT patch processing. So, what is the point of designing a good PCB pad? Let's take a look.



 


1. Symmetry of PCB pads: In order to ensure the balance of the surface tension of the molten solder, the pads at both ends of the PCB pads must be symmetrical, so that we will not have adverse effects when we use them later.


2. PCB pad spacing: If the PCB pad spacing is too large or too small, it will cause welding defects. Therefore, we need to ensure that the distance between the component ends or pins and the pads is appropriate, so that the welding will be more efficient. aspect.


3. Remaining size of PCB pad: The remaining size of the component end or pin of the PCB pad after overlapping with the pad must ensure that the solder joint can form a meniscus, which is conducive to our welding.


4. PCB pad width: The width of the PCB pad should be basically the same as the width of the component terminals or pins. In this way, it is not only standardized, but also can maximize the utilization without waste.


After going through the above introduction, I believe you already know what are the main points of designing PCB pads in MT patch processing.

                   
                   
                   
                   
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