Materials used: CEM-1, FR4, ALU, CEM-3, Rogers, HDI, etcFR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), lead-free solder tab, halogen-free FR4, ceramic filler material, PI material , BT material, PPO, PPE, etc.
Surface Treatment: HASL, OSP, Immersion Silver, Immersion Gold, ENIG, ENEPIG, Immersion Tin
Quality Control: X-ray, AOI testing, functional testing
Application areas: Internet of things, medical, security, GPS tracker, PLC control, automotive electronics
Service Areas: PCB, Turnkey PCBA, PCB Cloning, Enclosures, PCB Assembly, Component Sourcing, PCB Development and Design, PCB Manufacturing from 1 to 64 Layers
Prestressing: buried via, blind via, mixed voltage, embedded resistor, embedded capacitor, local mixed voltage, local high density, back drilling, impedance control.
Pre-sales consultant
